Data Center Switch
DS5000
64 high-density OSFP 800GbE optical ports, Switching capacity: 102.4Tbps
2U rack-mount open bare-metal 800GbE high-density data center switch
2+2 redundant hot-swappable 2000W high-power AC power supplies and 3+1 redundant hot-swappable fan modules
OCP-inspired standard ONIE open bare-metal switch, including SONiC, fully decoupling hardware and software
OVERVIEW
DS5000 is a 2U open bare-metal 800G high-density spine switch with 64 OSFP 800GbE ports, supporting breakout to 100G/200G/400G sub-rate ports. Built on Broadcom Tomahawk5 ASIC with 51.2Tbps switching bandwidth, ultra-low forwarding latency and industry-leading power efficiency. Equipped with 2+2 redundant hot-swappable PSUs, 3+1 redundant fans, dual airflow design and independent OpenBMC IPMI out-of-band management. Standard OCP ONIE open architecture compatible with SONiC, supporting lossless RDMA transmission, telemetry and high-precision clock synchronization, ideal for AI large model training clusters, HPC and hyperscale cloud data center leaf-spine fabric networking.
FEATURES
✅ 2U rack-mount open bare-metal 800G data center spine switch, powered by flagship Broadcom Tomahawk5 ASIC, deeply optimized for AI large model training, HPC supercomputing and hyperscale cloud fabric.
✅ 64 × OSFP 800GbE high-density optical ports; each port supports flexible breakout into 2×400G / 4×200G / 8×100G sub-rate ports, meeting multi-layer CLOS leaf-spine deployment of AI spine core, storage aggregation and multi-cloud access.
✅ Industry-leading total switching bandwidth up to 51.2 Tbps with ultra-large shared packet buffer, ultra-low cut-through forwarding latency, excellent burst absorption for massive parallel AI training traffic; power efficiency improved by over 75% vs previous-generation 400G switches.
✅ Full redundant enterprise-grade reliable hardware: 2+2 redundant hot-swappable 2000W high-power AC power supplies, 3+1 redundant hot-swappable fan modules; dual airflow options (F2B / B2F) to match all types of server cabinet cooling layouts.
✅ High-performance multi-core Intel Xeon D modular x86 control plane, independent OpenBMC out-of-band management chip, fully compliant with IPMI 2.0 & Redfish standards; support remote hardware health monitoring, fault alarm and remote power on/off control.
✅ Standard OCP-based ONIE open bare-metal architecture, natively compatible with mainstream open NOS including SONiC, fully decoupled hardware & software to support highly customized AI computing fabric deployment.
✅ Complete full-stack L2/L3 routing protocols: IPv4/IPv6 dual stack, static route, OSPF, IS-IS, MP-BGP, ECMP/WCMP, VRF, VRRP, MC-LAG, IGMP/PIM multicast.
✅ Full DCB lossless Ethernet suite: DCBX, PFC priority flow control, ETS enhanced transmission selection, QCN congestion notification, optimized for RDMA low-latency lossless transmission of AI training & storage clusters.
✅ Hardware accelerated VXLAN overlay virtual tunnel, TRILL, NVGRE, supporting large-scale multi-tenant cloud virtual networking.
✅ Multi-level refined QoS scheduling, multi-port independent QoS queues, two-rate three-color traffic policing, DSCP mapping, airtime fairness and port bandwidth limitation to guarantee stable multi-service concurrent transmission.
✅ Comprehensive multi-layer security defense: hardware ACL filtering, anti-DDoS attack, port isolation, broadcast storm suppression, access control to prevent cross-tenant data leakage.
✅ Powerful automated O&M capabilities: ZTP zero-touch automatic deployment, high-precision real-time telemetry, packet timestamp, buffer transient traffic capture; support CLI, SSH, SNMP, REST API multi-mode management, easy docking with cloud native automation platforms.
✅ Optional IEEE1588v2 & SyncE high-precision clock synchronization module, compatible with ZR/ZR+ coherent long-distance optical modules to meet cross-data-center long-distance interconnection demands.
SPECIFICATIONS
| Basic Hardware & Switch Chip | Model: DS5000 |
| Switch ASIC: Broadcom Tomahawk5 flagship switching chip | |
| Form Factor: 19-inch standard 2U rack-mount chassis | |
| Switching Bandwidth: 51.2 Tbps | |
| Shared Packet Buffer: Ultra-large high-capacity shared buffer | |
| Cut-through Latency: Ultra-low port-to-port forwarding latency | |
| Forwarding Table Capacity: Massive LPM routing table, multi-layer hardware ACL entry storage, support millions of cloud multi-tenant routes | |
| Interface Specifications | Data Ports: 64 × QSFP-DD 800GbE high-density optical ports |
| Port Breakout Capability: Each QSFP port supports flexible speed splitting: 2×400G / 4×200G / 8×100G sub-rate ports | |
| Auxiliary Management Ports: | |
|
1 × RJ45 Gigabit shared CPU/BMC management Ethernet port 1 × RJ45 RS232 serial Console debug port 1 × Type-A USB 2.0 local storage port |
|
| Optional 1-2 × SFP+ 10G auxiliary optical ports | |
| Control Plane & BMC OOB Management | CPU Module: COM-E modular Intel Xeon D x86 processor, 4-core standard configuration |
| Memory: Standard 16GB ECC DDR4, expandable up to 32GB | |
| Local Storage: M.2 SSD (default 64GB) | |
| BMC Management: Independent BMC management chip, fully compliant with IPMI 2.0 standard | |
| Support remote hardware health monitoring, fault alarm, remote power on/off control | |
| Installation Architecture: Standard ONE open bare-metal installation system | |
| Power, Cooling & Power Consumption | Power Supply: 1+1 redundant hot-swappable 1500W AC power modules |
| Input Voltage: AC 100–240V auto-ranging, 47–63Hz | |
| Cooling Fans: 6+1 redundant hot-swappable fan modules | |
| Airflow Options: Dual airflow design, Front-to-Back (F2B) / Back-to-Front (B2F) optional | |
| Peak Power Consumption: 1100W (with full QSFP-DD 400G optical modules) | |
| Physical Dimension & Environment | Dimension: H 43.1mm × W 438.5mm × D 657.5mm |
| Operating Temperature: 5℃ ~ +40℃ (both airflow modes) | |
| Storage Temperature: -40℃ ~ +70℃ | |
| Operating Relative Humidity: 40% ~ 60% RH, non-condensing | |
| Storage Relative Humidity: 5% ~ 95% RH, non-condensing | |
| MTBF: ≥150,000 hours | |
| L2/L3 & Data Center Features | L2/L3 Routing Protocols |
| IPv4/IPv6 dual stack, static route, RIP, OSPF, IS-IS, MP-BGP, ECMP/WCMP, VRF, VRRP | |
| VLAN, STP/RSTP/MSTP, MC-LAG, IGMP Snooping, PIM-SM/PIM-DM/PIM-SSM multicast | |
| DCB Lossless Ethernet | |
| DCBX, PFC priority flow control, ETS enhanced transmission selection, QCN congestion notification | |
| Support RDMA low-latency lossless transmission for AI computing & storage clusters | |
| Overlay Virtual Network | |
| VXLAN overlay tunnel encapsulation/decapsulation, TRILL, NVGRE, L2 GRE, hardware-based tunneling | |
| QoS & Traffic Management | |
| 10 independent QoS queues per port for unicast/multicast traffic | |
| SP, WRR, WDRR multi-level scheduling, two-rate three-color traffic policing | |
| Per-port DSCP mapping, airtime fairness scheduling, port-level bandwidth limitation | |
| Security & Telemetry | |
| Multi-layer hardware ACL filtering, anti-DDoS attack defense, port isolation, storm control | |
| Real-time high-precision telemetry, packet timestamp, buffer instantaneous traffic capture | |
| Optional IEEE1588v2 & SyncE high-precision clock synchronization module | |
| Management Methods | Local Management: CLI serial console, local WEB GUI |
| Remote Management: SSH, SNMP v2c/v3, REST API, ZTP zero-touch automatic provisioning | |
| Out-of-band Management: BMC IPMI 2.0 remote power control, full hardware real-time health monitoring |
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