Data Center Switch
DS3000
32 10G QSFP28 ports, Switching capacity: 3.2Tbps
redundant hot-swappable power and fans
ONIE open architecture compatible with SONiC/AsterNOS
ideal for leaf/spine CLOS network
OVERVIEW
DS3000 is a 1U open bare-metal 100G data center switch with 32 QSFP28 ports, supporting breakout to 25G/50G sub-rate ports. Built on Trident3 chip, it provides low-latency wire-speed forwarding, redundant hot-swappable power and fans, dual airflow design, ONIE open architecture compatible with SONiC/AsterNOS, ideal for leaf/spine CLOS networking of cloud and AI computing data centers.
FEATURES
✅ Compact 1U rack-mount form factor, second-generation open bare-metal 100G data center switch based on Broadcom Trident3-X7 high-performance switching ASIC.
✅ Equipped with 32 QSFP28 100GbE ports, supports flexible port breakout; expandable to maximum 128×25G or 64×50G sub-rate ports to meet TOR leaf, spine core and aggregation layer CLOS architecture deployment demands.
✅ Adopts PHYless simplified hardware architecture, delivering ultra-low forwarding latency and outstanding power efficiency; peak power consumption controlled below 500W under full optical module loadCelestica ….
✅ Enterprise-grade high-reliability design: 1+1 redundant hot-swappable AC power supplies, 3+1 redundant hot-swappable fan modules; dual airflow options (front-to-back / back-to-front) to match different server cabinet cooling layouts.
✅ Standard ONIE open installation architecture, natively compatible with mainstream open network operating systems including SONiC and AsterNOS, fully decoupling hardware and software to realize flexible customized network deployment.
✅ Modular COM-E x86 control plane equipped with independent BMC out-of-band management module, supports precise timing synchronization, reserved auxiliary management ports for automated data center operation and maintenance.
✅ Total switching bandwidth up to 3.2Tbps with 32MB large packet buffer, provides excellent burst absorption and congestion handling capability for high-density multi-service concurrent scenariosCelestica ….
✅ Complete L2/L3 data center feature set: VXLAN overlay virtual network, RDMA low-latency transmission, comprehensive QoS scheduling, DCBX PFC/ETS lossless Ethernet, multi-level ACL security filtering and anti-DDoS attack defense.
✅ Supports mainstream routing protocols (BGP, OSPF, IS-IS), complete telemetry monitoring, REST API, SNMP and CLI multi-mode management, easy to integrate with cloud automation operation platforms.
SPECIFICATIONS
| Basic Hardware & Switch Chip | Model: DS3000 |
| Switch ASIC: Broadcom Trident3-X7 (BCM56870) | |
| Form Factor: 19-inch standard 1U rack-mount chassis | |
| Forwarding Architecture: PHYless simplified hardware | |
| Switching Bandwidth: 3.2 Tbps | |
| Packet Buffer: 32MB shared packet buffer | |
| Cut-through Latency: <500ns port-to-port latency | |
| Max Concurrent Forwarding Entries: 324K LPM routing table, 128K ACL entries, 48K MPLS labels | |
| Interface Specifications | Data Port: 32 × QSFP28 100GbE optical ports |
| Port Breakout Support: Each QSFP28 can split into 4×25G or 2×50G; maximum 128×25G sub-rate ports | |
| Auxiliary Ports: | |
| 1–2 × SFP+ 10G auxiliary optical ports 1 × RJ45 shared management Ethernet port | |
| 1 × RJ45 serial Console port | |
| Control Plane & BMC OOB Management | CPU Module: COM-E modular Intel Atom C3558R x86 processor |
| Memory: 4GB–32GB configurable ECC DDR4 | |
| Local Storage: M.2 SSD (default 64GB) | |
| BMC Management: Independent BMC chip, support IPMI 2.0 remote out-of-band management | |
| Installation Architecture: Standard ONIE open bare-metal installation system | |
| Compatible NOS: SONiC, AsterNOS and other mainstream open network operating systems | |
| Power, Cooling & Power Consumption | Power Supply: 1+1 redundant hot-swappable AC power modules |
| Input Voltage: AC 100–240V auto-ranging, 47–63Hz | |
| Cooling Fans: 3+1 redundant hot-swappable fan | |
| Airflow Options: Front-to-Back (F2B) / Back-to-Front (B2F) dual airflow design | |
| Peak Power Consumption: ≤500W under full optical module load | |
| Physical Dimension & Environment | Dimension: H 44mm × W 438mm × D 520mm |
| Operating Temperature: 0℃ ~ +45℃ (altitude ≤900m) | |
| Storage Temperature: -40℃ ~ +70℃ | |
| Humidity: 5% ~ 90% RH, non-condensing | |
| MTBF: ≥150,000 hours | |
| L2/L3 & Data Center Features | L2/L3 Protocols |
| IPv4/IPv6 dual stack, static route, RIP, OSPF, MP-VLAN, STP/RSTP/MSTP, IGMP Snooping, MC-LAG | |
| Data Center DCB & Lossless Ethernet | |
| DCBX, PFC, ETS, QCN congestion notification | |
| VXLAN overlay virtual network (encapsulation/decapsulation TEP) | |
| TRILL, NVGRE, L2 GRE overlay tunneling | |
| QoS & Traffic Management | |
| Multi-level queue scheduling (SP, WRR, WDRR), per-port DSCP mapping | |
| Two-rate three-color policing, airtime fairness scheduling | |
| RDMA low-latency lossless transmission support | |
| Security & Telemetry | |
| Multi-layer ACL filtering, anti-DDoS attack defense | |
| Real-time telemetry, packet timestamp, buffer transient capture statistics | |
| IEEE1588 & SyncE precision clock synchronization | |
| Management Methods | Local Management: CLI serial console, local WEB GUI |
| Remote Management: SSH, SNMP v2c/v3, REST API, ZTP zero-touch provisioning | |
| Out-of-band Management: BMC IPMI 2.0 remote power control, hardware health monitoring |
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